概要
マーケットが急速に変化する中、ICパッケージ・PCB設計では高密度対応や迅速な変革への要求が高まっています。従来ツールでは現代の設計規模と複雑さ、厳しい開発スケジュールに十分に対応しきれません。
Cadenceは、複雑な設計を自然言語でこなしワークフローを効率化するAI主導のソリューションにフォーカスしています。先進ツールに高速化やAI最適化、高度なエージェント等を組み合わせた新しい設計環境は、設計サイクルを50％以上短縮し、激しい市場競争において優位を維持することを可能とします。
このAI主導のアプローチによりレベルアップされる設計プロセスについてぜひご確認ください。
講演者情報
Cadence Design Systems,Inc.
System Design & Analysis.
Sr. Group Director Product Engineering
Bimal Gisuthan
【職歴】
With 25 years of experience, Bimal has held multiple senior management roles at Cadence, demonstrating wide-ranging knowledge from chip design to packaging, and now system design. He is currently responsible for driving AI solutions in the system design and analysis space. Before joining Cadence, Bimal held research positions in Singapore, further strengthening their technical foundation and research acumen. He earned his bachelor’s degree in Electronics and Communication from the University of Kerala, India, and went on to complete a Master of Applied Science at Nanyang Technological University, Singapore.
System Design & Analysis.
Sr. Group Director Product Engineering
Bimal Gisuthan
【職歴】
With 25 years of experience, Bimal has held multiple senior management roles at Cadence, demonstrating wide-ranging knowledge from chip design to packaging, and now system design. He is currently responsible for driving AI solutions in the system design and analysis space. Before joining Cadence, Bimal held research positions in Singapore, further strengthening their technical foundation and research acumen. He earned his bachelor’s degree in Electronics and Communication from the University of Kerala, India, and went on to complete a Master of Applied Science at Nanyang Technological University, Singapore.